Yang Hu

Kinetics of interfacial reaction between Sn-3.0Ag-0.5Cu solder and Co-4.0P or Co-8.0P metallization

Q. Wang, Liangliang Li, Jian Cai, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Effects of post-CMP annealing on TSV Cu protrusion and leakage current

Q. Wang, Jian Cai, Yang Hu, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

Hongda Du, Q. Wang, Liangliang Li, 2014 .

Electroplating Cu on ALD TiN for high aspect ratio TSV

Q. Wang, Wenqi Zhang, Jian Cai, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Dependence of shear strength of Sn–3.8Ag–0.7Cu/Co–P solder joints on the P content of Co–P metallization

Liangliang Li, Shuang Liu, Yang Hu, 2019, Journal of Materials Science: Materials in Electronics.

Significantly enhanced shear strength of Sn-Ag-Cu/Co-P ball grid array solder joints by CoSn3 intermetallic compound

Liangliang Li, Jian Cai, Donghua Yang, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

IMC growth and shear strength of Sn–Ag–Cu/Co–P ball grid array solder joints under thermal cycling

Liangliang Li, Jian Cai, Donghua Yang, 2015, Journal of Materials Science: Materials in Electronics.

Performance and reliability study of Pd-coated copper wire bonding on ENEPIG substrate

Shuidi Wang, Jian Cai, Jingwei Li, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Development of Hybrid Bonding Process for Embedded Bump with Cu-Sn/BCB Structure

Jian Cai, Yang Hu, Huang Chen, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

Low Temperature Cu-Cu Bonding Using Ag Nanostructure for 3D Integration

Jian Cai, Yang Hu, Ziyu Liu, 2015 .