Y. Ko

发表

Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate

Taek‐Soo Kim, Min-Su Kim, Y. Ko, 2015, Journal of Electronic Materials.

Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene.

Taek‐Soo Kim, Taeshik Yoon, Y. Ko, 2016, ACS applied materials & interfaces.

Effects of Ag addition on solid-state interfacial reactions between Sn-Ag-Cu solder and Cu substrate

Mingyu Li, Taek‐Soo Kim, Y. Ko, 2017 .

Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module

Han-Bo-Ram Lee, Jungsoo Kim, Min-Su Kim, 2020 .

Facile and highly efficient fabrication of robust Ag nanowire–elastomer composite electrodes with tailored electrical properties

Mingyu Li, Haifeng Yang, Gang Chen, 2018 .

Effects of graphene oxide on the electromigration lifetime of lead-free solder joints

Taek‐Soo Kim, Gahui Kim, Kirak Son, 2018, Journal of Materials Science: Materials in Electronics.

Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging

Y. Ko, Junghwan Bang, Chang-Woo Lee, 2014 .

Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bonding

Young-Ho Kim, Min-Su Kim, Y. Ko, 2019, Journal of Materials Science: Materials in Electronics.

Joint reliability of Al wire bonding on OSP and ENIG surface-finished substrates under complex stress induced with current and temperature

Jungsoo Kim, Young-Bae Park, Y. Ko, 2022, Journal of Materials Science: Materials in Electronics.

Comparative Study of Drop Reliability between Cu and Ni(P)/Au UBM with Sn-3.5Ag-xZn Solders

Jin Yu, M. Cho, T. Lee, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling

Y. Ko, Junghwan Bang, Chang-Woo Lee, 2014 .

Interfacial reactions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni(P) and Ni/Sn/(OSP)Cu structures for power modules

Jungsoo Kim, Min-Su Kim, Y. Ko, 2021, Journal of Materials Science: Materials in Electronics.

Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

H. Nishikawa, Dong-Yurl Yu, Y. Ko, 2019, Microelectronics Reliability.

Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

S. Jung, Jungsoo Kim, Tae-Ik Lee, 2021, Materials.

Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition

H. Nishikawa, Jeong-Won Yoon, Dong-Yurl Yu, 2018, Metals.

Microstructure evolution, interfacial reaction and mechanical properties of lead-free solder bump prepared by induction heating method

Mingyu Li, Yong-Ho Ko, Hongjun Ji, 2016 .

Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering

Mingyu Li, Y. Ko, Chang-Woo Lee, 2016 .

Reliability of Ag Nanoporous Bonding Joint for High Temperature Die Attach under Temperature Cycling

H. Nishikawa, Min-Su Kim, Y. Ko, 2016 .

Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate

D. Byun, Min-Su Kim, Dong-Yurl Yu, 2021, Metals.

Effects of Zn addition on the drop reliability of Sn–3.5Ag–xZn/Ni(P) solder joints

Jin Yu, Jin Yu, Y. Ko, 2007 .

Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad

Jin Yu, Jin Yu, Y. Ko, 2007 .

Effective (Pd,Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad

Min-Su Kim, Y. Sohn, Y. Ko, 2022, Microelectronics Reliability.

The effect of intermetallic compound evolution on the fracture behavior of Au stud bumps joined with Sn-3.5Ag solder

Sehoon Yoo, Yong-Ho Ko, Jun-Ki Kim, 2013, Electronic Materials Letters.

The Chip Bonding Technology on Flexible Substrate by Using Micro Lead-free Solder Bump

Min-Su Kim, Y. Ko, Junghwan Bang, 2012 .

Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layer

Young-Ho Kim, Min-Su Kim, Y. Ko, 2020, Journal of Materials Science: Materials in Electronics.

Reflow Behavior and Board Level BGA Solder Joint Properties of Epoxy Curable No-clean SAC305 Solder Paste

Y. Ko, Junghwan Bang, Jun-Ki Kim, 2015 .

Study on Joint of Micro Solder Bump for Application of Flexible Electronics

Taek‐Soo Kim, Min-Su Kim, Y. Ko, 2013 .

Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates

Mingyu Li, Taek‐Soo Kim, Y. Ko, 2017 .

A Study on the Electrochemical Corrosion Property of Sn-xSb Solder Alloy

Dong-Yurl Yu, Y. Ko, Junghwan Bang, 2018, Journal of Welding and Joining.

Effects of Flux Activator on Wettability and Slump of Sn-Ag-Cu Solder Paste

권순용, Hoo-Jeong Lee, Y. Ko, 2018 .

Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications

Sehoon Yoo, Chang-Woo Lee, Jeong-Won Yoon, 2014 .

Evaluation on Reliability of High Temperature Lead-free Solder for Automotive Electronics

Y. Ko, Chang-Woo Lee, S. Yoo, 2010 .

Micro-bump Joining Technology for 3 Dimensional Chip Stacking

Y. Ko, Chang-Woo Lee, Young-Ki Ko, 2014 .

Trends of Researches and Technologies of Electronic Packaging Using Graphene

Dong-Yurl Yu, Y. Ko, Junghwan Bang, 2016 .

Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene.

Taek‐Soo Kim, Taeshik Yoon, Y. Ko, 2016, ACS applied materials & interfaces.