Manseok Park

Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics

Manseok Park, S. Baek, Sungdong Kim, 2015 .

Evaluation of Si liquid cooling structure with microchannel and TSV for 3D application

Manseok Park, Sungdong Kim, S. Kim, 2017 .

Experimental characterization of TSV liquid cooling for 3D integration

Manseok Park, Sungdong Kim, S. Kim, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

TSV Liquid Cooling System for 3D Integrated Circuits

Manseok Park, Sungdong Kim, S. Kim, 2013 .

Study of Chip-level Liquid Cooling for High-heat-flux Devices

Manseok Park, Sungdong Kim, S. Kim, 2015 .

Evaluation of Si liquid cooling structure with microchannel and TSV for 3D application

Manseok Park, Sungdong Kim, S. Kim, 2016, Microsystem Technologies.