T. Luu
发表
K. Aasmundtveit,
N. Hoivik,
T. Luu,
2015,
2015 European Microelectronics Packaging Conference (EMPC).
D. Flynn,
K. Aasmundtveit,
H. Liu,
2014,
2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).
D. Dysthe,
E. Jettestuen,
A. Neuville,
2017,
Lab on a chip.
Pb(II) adsorption mechanism and capability from aqueous solution using red mud modified by chitosan.
H. A. T. Kiet,
T. Luu,
N. Tran,
2021,
Chemosphere.
H. A. T. Kiet,
D. Phong,
T. Luu,
2022,
Materials Chemistry and Physics.
T. Nguyen,
Tran Thi Kieu Anh,
T. Luu,
2020,
Environmental Science and Pollution Research.
H. Chuang,
T. Luu,
T. Vu,
2021,
Journal of analytical methods in chemistry.
H. A. T. Kiet,
T. Luu,
Van‐Phuc Dinh,
2021,
Environmental Monitoring and Assessment.
T. Luu,
Q. Tran,
Van‐Phuc Dinh,
2021
.
T. A. Tollefsen,
K. Aasmundtveit,
Hoang-Vu Nguyen,
2018,
2018 7th Electronic System-Integration Technology Conference (ESTC).
T. A. Tollefsen,
K. Aasmundtveit,
Hoang-Vu Nguyen,
2018,
Intermetallic Compounds - Formation and Applications.
Solid-Liquid Interdiffusion (SLID) bonding — Intermetallic bonding for high temperature applications
T. A. Tollefsen,
K. Aasmundtveit,
N. Hoivik,
2013,
2013 Eurpoean Microelectronics Packaging Conference (EMPC).
Knut E. Aasmundtveit,
Nils Hoivik,
Ani Duan,
2013,
Journal of Electronic Materials.
K. Aasmundtveit,
N. Hoivik,
T. Luu,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Astrid-Sofie B. Vardøy,
K. Aasmundtveit,
N. Hoivik,
2015,
Metallurgical and Materials Transactions A.
T. Nguyen,
L. Tan,
T. Luu,
2020,
Chemosphere.
K. Aasmundtveit,
N. Hoivik,
T. Luu,
2015
.
Astrid-Sofie B. Vardøy,
T. A. Tollefsen,
K. Aasmundtveit,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
A. Larsson,
T. A. Tollefsen,
K. Aasmundtveit,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
H. A. T. Kiet,
Hien Ho,
D. Pham,
2021,
Chemosphere.
T. Luu,
Viet Le Nam Vo,
Youngmin Chung,
2022,
Catalysis Today.