H. Hsiao

发表

Failure Mechanism for Fine Pitch Microbump in Cu/Sn/Cu System During Current Stressing

T. Chai, A. Trigg, H. Hsiao, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Electromigration reliability and morphologies of Cu pillar with microbump under high current density stressing

H. Hsiao, Jong-Kai Lin, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Laser de-bonding process development of glass substrate for Fan-out wafer level packaging

S. W. Ho, H. Hsiao, B. L. Lau, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

Study on failure mode and mechanism of bond pad under Cu ball bonding process using wire pull test and finite element modeling

F. Che, T. Chai, L. C. Wai, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Electromigration in Pb‐Free Solder Joints in Electronic Packaging

K. Tu, Chih Chen, H. Hsiao, 2012 .

Study of dielectric materials coating conformality and adhesiveness on epoxy mold compound surface

David Ho, H. Hsiao, B. L. Lau, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition

H. Hsiao, Tao-Chi Liu, Chien-min Liu, 2012 .

Thermomigration in flip-chip SnPb solder joints under alternating current stressing

Hsiang-Yao Hsiao, Chih Chen, H. Hsiao, 2007 .

Thermomigration in solder joints

K. Tu, F. Ouyang, Chih Chen, 2012 .

The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering

King-Ning Tu, Hsiang-Yao Hsiao, K. Tu, 2012 .

Study of interaction between Cu-SnAg and Ni-SnAg interfacial reactions by low solder volume in 3D IC packaging

H. Hsiao, C. Chen, Yi-Sa Huang, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Thermomigration in Pb-free SnAg solder joint under alternating current stressing

Hsiang-Yao Hsiao, Chih Chen, H. Hsiao, 2009 .

Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu

K. Tu, Chih Chen, H. Hsiao, 2011 .

Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints

Y. Lai, Luhua Xu, Chih Chen, 2009 .

Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

Han-wen Lin, King-Ning Tu, Hsiang-Yao Hsiao, 2012, Science.

Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy

Chih Chen, K. N. Tu, Hsiang-Yao Hsiao, 2013, Microelectron. Reliab..

Comparison of the electromigration behaviors between micro-bumps and C4 solder bumps

C. C. Chiu, Doug C. H. Yu, C. C. Hsieh, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Measurement of temperature distribution in SnAg3.5 flip-chip solder joints during current stressing using infrared microscopy

Chih Chen, H. Hsiao, 2009, 2008 International Conference on Electronic Materials and Packaging.

Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy

Da-Jeng Yao, Hsiang-Yao Hsiao, S. W. Liang, 2008 .

Stress Analysis and Design Optimization for Low- $k$ Chip With Cu Pillar Interconnection

Xiaowu Zhang, Jong-Kai Lin, K. Y. Au, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Extremely anisotropic single-crystal growth in nanotwinned copper

K. Tu, Chia-ling Lu, J. Kuo, 2014 .

Ultra-Thin FO Package-on-Package for Mobile Application

S. W. Ho, Yong Han, T. Chai, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package

T. Chai, S. Chong, H. Hsiao, 2021, 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).

Laser drilling and Plasma Cleaning Process for Blind Via Through Mold Interconnect

T. Chai, S. Chong, H. Hsiao, 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).

Damage characterization study using piezoresistive stress sensors for wire bonding process

Xiaowu Zhang, T. Chai, N. Jaafar, 2015, 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC).

Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging

K. Tu, Chia-ling Lu, J. Kuo, 2015, 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).

Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad

K. Y. Au, Xiaowu Zhang, F. Che, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).