H.T. Ma

Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient

N. Zhao, Y. Zhong, M. Huang, 2015, Scientific Reports.

Continuous growth and coarsening mechanism of the orientation-preferred Cu6Sn5 at Sn-3.0Ag/(001)Cu interface

C. Dong, P. Priyanka, H.T. Ma, 2020 .