Jong-Kai Lin

发表

Electromigration reliability and morphologies of Cu pillar with microbump under high current density stressing

H. Hsiao, Jong-Kai Lin, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Damage mechanics of microelectronics solder joints under high current densities

D. Frear, C. Basaran, D. Hopkins, 2003, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Mechanical tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

Jong-Kai Lin, A. De Silva, Jin-Wook Jang, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology

D. Frear, T. Lee, Jin-wook Jang, 2001 .

Reliability evaluations of chip interconnect in lead-free solder systems

Yifan Guo, Jong-Kai Lin, A. Silva, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Thermal compression bonding with non-conductive adhesive of 30μm pitch Cu pillar micro bumps on organic substrate with bare Cu bondpads

K. Y. Au, Jong-Kai Lin, J. Aw, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer

Daniel Ismael Cereno, V. S. Rao, S. Lim, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Ripening-assisted void formation in the matrix of lead-free solder joints during solid-state aging

D. Frear, K. Tu, T. Lee, 2007, Journal of Materials Research.

Characterization of lead-free solders and under bump metallurgies for flip-chip package

Li Li, Jong-Kai Lin, Yifan Guo, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Characterization of solder joint electromigration for flip chip technology

Jin-wook Jang, J. White, Jong-Kai Lin, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Electromigration studies of lead-free solder balls used for wafer-level packaging

Jong-Kai Lin, Christine Hau-Riege, You-Wen Yau, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Heterogeneous 2.5D integration on through silicon interposer

Xiaowu Zhang, Roshan Weerasekera, Dim-Lee Kwong, 2015 .

Stress Analysis and Design Optimization for Low- $k$ Chip With Cu Pillar Interconnection

Xiaowu Zhang, Jong-Kai Lin, K. Y. Au, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/Low-K Chip

F. X. Che, Jong-Kai Lin, K. Y. Au, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis

Fa Xing Che, Xiaowu Zhang, Jong-Kai Lin, 2016, Microelectron. Reliab..

Spalling of Cu3Sn intermetallics in high-lead 95Pb5Sn solder bumps on Cu under bump metallization during solid-state annealing

Jong-Kai Lin, D. R. Frear, Jin-Wook Jang, 2004 .

Interfacial reaction of eutectic AuSi solder with Si (100) and Si (111) surfaces

D. Frear, Jin-wook Jang, Jong-Kai Lin, 2004 .

Assembly Process and Warpage Management of Large Size through Silicon Interposer (38.7mm × 26.7mm) Package

Xiaowu Zhang, Zhaohui Chen, S. Lim, 2016, Electronic Components and Technology Conference.

Pb-free solder paste reflow window study for flip chip wafer bumping

Jong-Kai Lin, Y. Rao, Li Li, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

Lead-free flip chip interconnect reliability for DCA and FC-PBGA packages

D. Frear, Jin-wook Jang, Jong-Kai Lin, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Thermal fatigue properties of lead-free solders on Cu and NiP under bump metallurgies

C. Zhang, Jong-Kai Lin, Li Li, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Conductive polymer bump interconnects

Ranjan Sharma, T. Scharr, Jong-Kai Lin, 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

Development of fluxless flip chip reflow process for high density flip chip interconnect

V. S. Rao, S. Lim, Jong-Kai Lin, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Squeegee bump technology

Jong-Kai Lin, T. Fang, R. Bajaj, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Characterization and Annealing of Sputtered AlN Films for Piezoelectric Resonators

H. M. Liaw, H. Tompkins, Jong-Kai Lin, 1994 .

Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad

K. Y. Au, Xiaowu Zhang, F. Che, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).