Y. T. Huang

Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits

Tao-Chih Chang, Hsueh-Hsien Hsu, Y. T. Huang, 2015, Journal of Electronic Materials.

AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint under thermal aging

L. Tsao, T. Chuang, Y. T. Huang, 2001 .

Effect of voltage on microstructure and corrosion resistance of microarc oxidation coatings on CP-Ti

S. Y. Chang, L. Tsao, H. K. Lin, 2014 .

Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

Hsueh-Hsien Hsu, Y. T. Huang, A. Wu, 2014 .

Surface electron accumulation and enhanced hydrogen evolution reaction in MoSe2 basal planes

Y. T. Huang, Kuei-Hsien Chen, T. Fu, 2021 .