A. Wu

发表

Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits

Tao-Chih Chang, Hsueh-Hsien Hsu, Y. T. Huang, 2015, Journal of Electronic Materials.

Electroless Co-P diffusion barrier for n-PbTe thermoelectric material

H. Chu, A. Wu, S. Chakroborty, 2017 .

Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates

Chih-han Yang, S. Lin, Chih-hao Chen, 2019, Materials Science and Engineering: A.

Assessment of microstructure and shear strength for low melting point tin-free alloys on Cu

Chih-hao Chen, A. Wu, S. Chakroborty, 2017 .

Development of New Low Melting Solder Alloys

Chih-hao Chen, A. Wu, Chang-meng Wang, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Interfacial Reactions of Low-Melting Sn-Bi-Ga Solder Alloy on Cu Substrate

Chih-hao Chen, A. Wu, Chang-meng Wang, 2015, Journal of Electronic Materials.

In Situ Synchrotron X-ray Diffraction Measurement of the Strain Distribution in Si Die for the Embedded Substrates

Tao-Chih Chang, T. Chiu, C. Ku, 2015, Journal of Electronic Materials.

The Effects of Solid-State Aging on the Intermetallic Compounds of Sn-Ag-Bi-In Solders on Cu Substrates

Minghui Chen, A. Wu, Ciou-Nan Siao, 2009 .

Copper-Zinc-Tin-Sulfide Thin Films via Annealing of Ultrasonic Spray Deposited Nanocrystal Coatings.

Nancy D. Trejo, E. Aydil, L. Francis, 2017, ACS applied materials & interfaces.

Co-P Diffusion Barrier for p-Bi2Te3 Thermoelectric Material

Hsin-yi Lee, A. Wu, Hsien-Chien Hsieh, 2018, Journal of Electronic Materials.

Study of Diffusion Barrier for Solder/n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules

A. Wu, Wen-Chih Lin, Yingnan Li, 2017, Journal of Electronic Materials.

Epitaxial growth of ZnO nanorod arrays via a self-assembled microspheres lithography

C. Ku, Hsin-yi Lee, A. Wu, 2017 .

Corrosion on automobile printed circuit broad

A. Wu, Tsan-Hsien Tseng, 2019, Microelectronics Reliability.

Metastable Ge nanocrystalline in SiGe matrix for photodiode

Jenq-Yang Chang, A. Wu, S. Cheng, 2015 .

Analysis of arrayed nanocapacitor formed on nanorods by flow-rate interruption atomic layer deposition

C. Ku, Hsin-yi Lee, A. Wu, 2017 .

Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures

C. Ku, Hsin-yi Lee, A. Wu, 2016, Journal of Materials Science.

A Comprehensive Study of Electromigration in Pure Sn: Effects on Crystallinity, Microstructure, and Electrical Property

Kwang-Lung Lin, Chien-Lung Liang, A. Wu, 2020, Acta Materialia.

Scratch-resistant zeolite anti-reflective coating on glass for solar applications

Chien-Hung Chen, A. Wu, Ya-Sen Sun, 2011 .

Stoichiometric Effect of Sb2Te3 Thin Film on Thermoelectric Property

A. Wu, Yang-Yuan Chen, V. K. Ranganayakulu, 2022, ACS Applied Energy Materials.

Interfacial reactions in thermoelectric modules

Sinn-wen Chen, Hsin-jay Wu, Pai-Chun Wei, 2018 .

Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials

C. Liao, A. Wu, C. Liao, 2011, Journal of Electronic Materials.

Elucidating the Metal-Induced Crystallization and Diffusion Behavior of Al/a-Ge Thin Films

Hsin-yi Lee, A. Wu, Chao-Nan Yeh, 2011, Journal of Electronic Materials.

Novel solid-state pressureless approach for Cu-embedded intermetallic interconnects at low temperature

Wei Liu, A. Wu, Kuo-Shuo Huang, 2021 .

Joint properties enhancement for PbTe thermoelectric materials by addition of diffusion barrier

H. Chu, A. Wu, Hsien-Chien Hsieh, 2020 .

Stress analysis of spontaneous Sn whisker growth

Albert T. Wu, King-Ning Tu, K. Tu, 2006 .

Corrosion behaviors of Co, Co/Pd, and Co/Pd/Au surface finishes

A. Wu, Sili Lin, Jui-Lin Chao, 2022, Journal of the Taiwan Institute of Chemical Engineers.

The effect of microstructure for Ni-based surface finishing thin film on corrosion behavior

Yi-Hung Liu, Jing-Chie Lin, A. Wu, 2023, Surface and Coatings Technology.

Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes

A. Wu, Yu-Ting Chang, Y. Tsai, 2016 .

Disruption of crystalline structure of Sn3.5Ag induced by electric current

Kwang-Lung Lin, A. Wu, Hanliang Huang, 2016 .

Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

Hsueh-Hsien Hsu, Y. T. Huang, A. Wu, 2014 .

Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder

A. Wu, Yueh Chiang, Robbin Cheng, 2010 .

Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates

Minghui Chen, A. Wu, Che-Hsun Huang, 2009 .

The composition of intermetallic compounds in Sn-Ag-Bi-In solders on Cu substrates

A. Wu, M. Chen, Y. Jieng, 2008, 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.

Co-sputtered Cu(Ti) thin alloy film for formation of Cu diffusion and chip-level bonding

Hsin-yi Lee, A. Wu, Hsien-Chien Hsieh, 2018, Materials Chemistry and Physics.

Electrorecrystallization of Metal Alloy

Y. Lai, C. Dong, Kwang-Lung Lin, 2013 .

Determination of Average Failure Time and Microstructural Analysis of Sn-Ag-Bi-In Solder Under Electromigration

A. Wu, K. Sun, 2009 .

Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads

Albert T. Wu, King-Ning Tu, K. Tu, 2007 .

In situ observation of stress evolution in pure tin strip under electromigration using synchrotron radiation x-ray

C. Ku, Hsin-yi Lee, A. Wu, 2010 .

Improvement of high-temperature thermal aging reliability of Ag–Au joints by modifying Ni/Au surface finish

K. Suganuma, Chuantong Chen, A. Wu, 2019, Journal of Materials Science: Materials in Electronics.

Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints

C. Y. Liu, A. Wu, C. T. Lu, 2013, Journal of Electronic Materials.

Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction

N. Tamura, B. Valek, J. Lloyd, 2004 .

High dislocation density of tin induced by electric current

Kwang-Lung Lin, Chien-Lung Liang, A. Wu, 2015 .

The diminishing of crystal structure of Sn9Zn alloy due to electrical current stressing

Kwang-Lung Lin, A. Wu, Jianfeng He, 2015 .

Direct observation and kinetic analysis of grain rotation in anisotropic tin under electromigration

A. Wu, Y. Hsieh, 2008 .

Electromigration-induced grain rotation in anisotropic conducting beta tin

K. Tu, C. Kao, A. Gusak, 2005 .

Microstructure evolution of tin under electromigration studied by synchrotron X-ray micro-diffraction

N. Tamura, K. Tu, J. Lloyd, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

Interfacial stability of eutectic SnPb solder and composite 60Pb40Sn solder on Cu/Ni(V)/Ti under-bump metallization

F. Hua, A. Wu, 2007 .

Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis

Tao-Chih Chang, T. Chiu, C. Ku, 2013, Journal of Electronic Materials.

Kinetic Analysis of Spontaneous Whisker Growth on Pre-treated Surfaces with Weak Oxide

C. Ku, Hsin-yi Lee, A. Wu, 2014, Journal of Electronic Materials.

Effect of Sn Film Grain Size and Thickness on Kinetics of Spontaneous Sn Whisker Growth

Wei Liu, C. Ku, Hsin-yi Lee, 2019, JOM.

The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment

Y. C. Ding, Albert T. Wu, Y. Ding, 2009, Microelectron. Reliab..

Preferred orientation relationships with large misfit interfaces between Ni3Sn4 and Ni in reactive wetting of eutectic SnPb on Ni

Albert T. Wu, King-Ning Tu, Nobumichi Tamura, 2011 .

Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress

Wei Yu Chen, C. Dong, Hsin-yi Lee, 2013 .

Back-Fill Sn Flux against Current-Stressing at Cathode Micro Cu/Sn Interface

C. Y. Liu, A. Wu, C. T. Lu, 2013 .

Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System

A. Wu, P. Chien, C. Yeh, 2013, Journal of Electronic Materials.

Massive spalling and morphological change of intermetallic compound affected by adding Pd in Co-based surface finishes

Hsin-yi Lee, A. Wu, J. Hong, 2013 .

Controlled positions and kinetic analysis of spontaneous tin whisker growth

Hsin-yi Lee, A. Wu, Hao Chen, 2011 .

Interfacial Stability in Bi2Te3 Thermoelectric Joints.

A. Wu, Hsien-Chien Hsieh, Chun-Hsien Wang, 2020, ACS applied materials & interfaces.

Analysis of Chlorine Ions in Antimony-Doped Tin Oxide Thin Film Using Synchrotron Grazing Incidence X-ray Diffraction

C. Ku, Hsin-yi Lee, A. Wu, 2012 .

High surface textured SnO2 hybrid thin films fabricated using the nozzle-spraying process for solar cell applications

A. Wu, L. Chou, Yang-Yi Lin, 2013 .

Bandgap narrowing in high dopant tin oxide degenerate thin film produced by atmosphere pressure chemical vapor deposition

C. Ku, Hsin-yi Lee, A. Wu, 2013 .

Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles

Wei Liu, A. Wu, Chang-meng Wang, 2021, Journal of the Taiwan Institute of Chemical Engineers.

Analysis of antimony doped SnO2 thin film by synchrotron grazing incidence X-Ray diffraction

C. Ku, Hsin-yi Lee, A. Wu, 2011, 2011 37th IEEE Photovoltaic Specialists Conference.

Evaluation of Diffusion Barrier Between Pure Sn and Te

A. Wu, C. Ko, 2012, Journal of Electronic Materials.

Interfacial Reactions Between Diffusion Barriers and Thermoelectric Materials Under Current Stressing

A. Wu, Li-Chen Lo, 2012, Journal of Electronic Materials.

Nucleation and propagation of voids in microbumps for 3 dimensional integrated circuits

Tao-Chih Chang, A. Wu, H. Hsu, 2011 .

Mechanism and prevention of spontaneous tin whisker growth

N. Tamura, K. Tu, C. Tung, 2005 .

Electrical current enhanced sintering without Joule heating for Cu nanoparticles at room temperature

K. Cheng, A. Wu, Chang-meng Wang, 2023, Materialia.

Hybrid Solder Joint for Low-Temperature Bonding Application

A. Wu, Chang-meng Wang, Jui-Lin Chao, 2022, Journal of Electronic Materials.

Mitigation of Power Factor Degradation in Bi2Te3 Thin Films

K. Cheng, A. Wu, Yang-Yuan Chen, 2023, ACS Applied Engineering Materials.

Crystallographic Orientation Effect on Electromigration in Ni-Sn Microbump

Albert T. Wu, Subhendu Chakroborty, Chih-hao Chen, 2017, JOM.