Zhikun Zhang

Dominant effect of high anisotropy in β-Sn grain on electromigration-induced failure mechanism in Sn-3.0Ag-0.5Cu interconnect

J. Zhao, M. Huang, N. Zhao, 2016 .

In situ study on reverse polarity effect in Cu/Sn–9Zn/Ni interconnect undergoing liquid–solid electromigration

N. Zhao, Mingliang L. Huang, F. Yang, 2015 .