J. Wittge

发表

Crack propagation and fracture in silicon wafers under thermal stress

A. Danilewsky, P. McNally, B. Tanner, 2013, Journal of applied crystallography.

Influence of mechanical defects on the crystal lattice of silicon

A. Danilewsky, P. McNally, J. Wittge, 2012 .

Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage & Strain in Fully Encapsulated Integrated Circuits

A. Danilewsky, P. McNally, D. Manessis, 2012, 1204.1466.

Dislocation dynamics and slip band formation in silicon: In-situ study by X-ray diffraction imaging

D. K. Bowen, A. Danilewsky, P. McNally, 2011 .

Dislocation generation related to micro-cracks in Si wafers: High temperature in situ study with white beam X-ray topography

A. Danilewsky, P. McNally, A. Cecilia, 2010 .

Quantitative Imaging of the Stress/Strain Fields and Generation of Macroscopic Cracks from Indents in Silicon

A. Danilewsky, P. McNally, B. Tanner, 2017 .

X-ray diffraction and imaging

J. Wittge, Konstantin Kiefl, D. Allen, 2016 .

Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage & Strain in Fully Encapsulated Integrated Circuits

A. Danilewsky, P. McNally, D. Manessis, 2012, 1204.1466.

Dislocation sources and slip band nucleation from indents on silicon wafers

D. K. Bowen, A. Danilewsky, P. McNally, 2010 .

Real‐time X‐ray diffraction imaging for semiconductor wafer metrology and high temperature in situ experiments

Patrik Vagovič, Patrick J. McNally, Alexander Rack, 2011 .

Thermal slip sources at the extremity and bevel edge of silicon wafers

P. McNally, B. Tanner, J. Wittge, 2011 .

Three-dimensional X-ray diffraction imaging of process-induced dislocation loops in silicon

A. Danilewsky, P. McNally, J. Wittge, 2011 .

X-ray diffraction imaging of dislocation generation related to microcracks in Si wafers

D. K. Bowen, A. Danilewsky, P. McNally, 2010, Powder Diffraction.

Observation of nano-indent induced strain fields and dislocation generation in silicon wafers using micro-Raman spectroscopy and white beam X-ray topography

Patrick J. McNally, D. Allen, E. Gorostegui-Colinas, 2010 .

White beam synchrotron topography using a high resolution digital X-ray imaging detector

Heinrich Riesemeier, Timm Weitkamp, Alexander Rack, 2008 .

X-ray asterism and the structure of cracks from indentations in silicon

A. Danilewsky, P. McNally, B. Tanner, 2016 .

Local strain and defects in silicon wafers due to nanoindentation revealed by full-field X-ray microdiffraction imaging.

A. Danilewsky, P. McNally, T. Baumbach, 2015, Journal of synchrotron radiation.

Combined use of three-dimensional X-ray diffraction imaging and micro-Raman spectroscopy for the non-destructive evaluation of plasma arc induced damage on silicon wafers

A. Danilewsky, P. McNally, M. Morshed, 2011 .

X-ray diffraction imaging for predictive metrology of crack propagation in 450-mm diameter silicon wafers

D. K. Bowen, A. Danilewsky, P. McNally, 2013, Powder Diffraction.

Crack propagation and fracture in silicon wafers under thermal stress

A. Danilewsky, P. McNally, T. Baumbach, 2013, Journal of applied crystallography.