A.-K. Tiedemann

Advanced dynamic failure analysis on interconnects by vectorized Scanning Joule Expansion microscopy

R. Heiderhoff, M. Fakhri, L. Balk, 2009, 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Thermal conductivity studies of a GaN-sapphire structure by combined scanning thermal microscopy and electron backscatter diffraction

R. Heiderhoff, L. Balk, A.-K. Tiedemann, 2009, 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations

J. C. H. Phang, L. J. Balk, R. Heiderhoff, 2009, Microelectron. Reliab..

Dedicated near-field microscopies for electronic materials and devices (Plenary Paper)

Ludwig Josef Balk, Jacob C. H. Phang, R. M. Cramer, 2005, SPIE Optical Metrology.

Artificially inscribed defects in opal photonic crystals

Clivia M. Sotomayor Torres, Rudolf Zentel, F. Jonsson, 2005 .