C.C. Wong

Moisture-induced failures of adhesive flip chip interconnects

S. Mhaisalkar, E. Wong, L. K. Teh, 2005, IEEE Transactions on Components and Packaging Technologies.

Direct metal to metal bonding for microsystems interconnections and integration

C.C. Wong, J. Wei, X. Ang, 2005, 2005 7th Electronic Packaging Technology Conference.

Pressure dependence in peripheral bonding in gold-gold thermocompression

J. Wei, X. Ang, C.C. Wong, 2006, 2006 8th Electronics Packaging Technology Conference.

First-principles simulation study on the effects of dopants on the cohesion of gold grain boundary

C.C. Wong, Y. H. Chew, Z. Bakar, 2007, 2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces.

Investigation of cure kinetics and its effect on adhesion strength of nonconductive adhesives used in flip chip assembly

S. Mhaisalkar, E. Wong, L. K. Teh, 2006, IEEE Transactions on Components and Packaging Technologies.

Evolution of Microstructure and Mechanical Properties of Eutectic Sn-Pb Solder Joint Aged under Thermal Gradient

Zhong Chen, S. Yoon, C.C. Wong, 2007, 2007 9th Electronics Packaging Technology Conference.

Effect of electric current on the mechanical properties and interfacial microstructure of Ni-P/Sn-3.5Ag and Ni/Sn-3.5Ag solder joints

S. Mhaisalkar, Zhong Chen, C.C. Wong, 2006, 2006 8th Electronics Packaging Technology Conference.

Chip-To-Substrate (First Level) Connection Technology Options

S. Bezuk, K. Puttlitz, C.C. Wong, 1993 .