Yan Yang

Development of 3D electro-optical integration based on silicon photonic TSV interposer

Yan Yang, 2016 .

Modeling and fabrication of traveling-wave electrode (TWE) of Si optical modulator via Cu-BEOL

Rusli, G. Lo, Mingbin Yu, 2015, 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC).

High-efficiency Si optical modulator using Cu travelling-wave electrode.

Guo-Qiang Lo, Mingbin Yu, Qing Fang, 2014, Optics express.

Through-Si-via (TSV) Keep-Out-Zone (KOZ) in SOI Photonics Interposer: A Study of the Impact of TSV-Induced Stress on Si Ring Resonators

Guo-Qiang Lo, Qing Fang, Junfeng Song, 2013, IEEE Photonics Journal.

3D Silicon Photonics Packaging Based on TSV Interposer for High Density On-Board Optics Module

Mingbin Yu, Qing Fang, Xiaoguang Tu, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

3D electro-optical integration based on high-performance Si photonics TSV interposer

Guo-Qiang Lo, Yan Yang, Mingbin Yu, 2016, 2016 Optical Fiber Communications Conference and Exhibition (OFC).