H. Nakazawa
发表
S. Sugahara,
H. Nakazawa,
M. Edo,
2000
.
T. Suga,
F. Mu,
Yinghui Wang,
2019,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2017,
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2016
.
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2016
.
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2015
.
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2014,
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2015,
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
T. Fukumoto,
H. Nakazawa,
R. Shohara,
2007
.
T. Suga,
Yoshikazu Takahashi,
E. Higurashi,
2019,
Applied Surface Science.
T. Fujii,
Masaharu Kato,
U. Dahmen,
2000
.
Haruo Nakazawa,
Yoichi Nabetani,
David H. Lu,
2018,
2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia).
Y. Nabetani,
H. Nakazawa,
T. Matsumoto,
2017
.
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
T. Suga,
M. Uomoto,
T. Shimatsu,
2019,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
Y. Nabetani,
H. Nakazawa,
T. Matsumoto,
2018
.
T. Suga,
F. Mu,
H. Nakazawa,
2017
.
K. Nakagawa,
M. Ogino,
H. Nakazawa,
2016
.
Haruo Nakazawa,
Kazuo Shimoyama,
Manabu Takei,
2006,
2006 IEEE International Symposium on Power Semiconductor Devices and IC's.
Precipitates formed in silicon wafers by prolonged high-temperature annealing in nitrogen atmosphere
Yoshikazu Takahashi,
M. Ogino,
Hitoshi Habuka,
2014
.
Haruo Nakazawa,
Kazumasa Imai,
Hiroyuki Narihara,
2003
.
Yoshikazu Takahashi,
M. Ogino,
Hitoshi Habuka,
2013
.
T. Suga,
F. Mu,
H. Nakazawa,
2016
.
Haruo Nakazawa,
Yoshikazu Takahashi,
Hiroki Wakimoto,
2011,
2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs.