Y.H. Lim

Stress-induced voiding beneath vias with wide copper metal leads

A. See, K. Pey, Y.K. Lim, 2004, Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743).

Stress-induced voiding in multi-level copper/low-k interconnects

K. Pey, C. Seet, Y.K. Lim, 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.