Chih Chen

发表

Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration

King-Ning Tu, S. W. Liang, K. Tu, 2006 .

Joule heating effect under accelerated electromigration in flip-chip solder joints

Chih Chen, D. Yao, S. Chiu, 2006, 56th Electronic Components and Technology Conference 2006.

Effect of under-bump-metallization structure on electromigration of Sn-Ag solder joints

Hsiao-Yun Chen, Chih Chen, Chih Chen, 2012 .

Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes

S. W. Liang, Chih Chen, Y. Chang, 2006 .

Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy

Chih Chen, You-Chun Liang, 2009 .

Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure

Chih Chen, Y. Chang, Y. W. Chang, 2007 .

Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy

Da-Jeng Yao, Hsiang-Yao Hsiao, S. W. Liang, 2008 .

3-D simulation on current density distribution in flip-chip solder joints with thick Cu UBM under current stressing

Chih Chen, S.W. Liang, T.L. Shao, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration

S. W. Liang, Chih Chen, Y. Chang, 2006 .

Effect of Si-die dimensions on electromigration failure time of flip-chip solder joints

D. J. Yao, Chih Chen, Shao-Yu Chiu, 2011 .

Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti∕Cr-Cu∕Cu and Ni(P)∕Au metallization pads

Yung-fu Chen, Chih Chen, T. Shao, 2004 .

Investigation of void nucleation and propagation during electromigration of flip-chip solder joints using x-ray microscopy

Chih Chen, S. Chiu, Chih Chen, 2006 .