K. Vaed

A manufacturable high-k MIM dielectric with outstanding reliability and voltage linearity for RF and mixed-signal technologies

J. Dunn, E. Eshun, K. Stein, 2004, Digest of Papers. 2004 Topical Meeting onSilicon Monolithic Integrated Circuits in RF Systems, 2004..

On wafer de-embedding for SiGe/BiCMOS/RFCMOS transmission line interconnect characterization

W. Woods, J. Rascoe, Y. Tretiakov, 2004, Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729).

A new on-wafer de-embedding technique for on-chip rf transmission line interconnect characterization

T. Zwick, W. Woods, Y. Tretiakov, 2004, ARFTG 63rd Conference, Spring 2004.

On-chip interconnect for mm-wave applications using an all-copper technology and wavelength reduction

T.S.D. Cheung, K. Stein, J. Long, 2003, 2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC..

An additive micromolding approach for the development of micromachined ceramic substrates for RF applications

K. Vaed, M.J. Madou, J. Florkey, 2004, Journal of Microelectromechanical Systems.