Pinjala Damaruganath

Assembly and reliability of micro-bumped chips with Through-silicon Vias (TSV) interposer

Vempati Srinivasa Rao, Tai Chong Chai, Ming Chinq Jong, 2009, 2009 11th Electronics Packaging Technology Conference.

TSV interposer fabrication for 3D IC packaging

Vempati Srinivasa Rao, Li Hong Yu, C. T. Chong, 2009, 2009 11th Electronics Packaging Technology Conference.

Effect of TSV interposer on the thermal performance of FCBGA package

John H. Lau, Kripesh Vaidyanathan, C. T. Chong, 2009, 2009 11th Electronics Packaging Technology Conference.

Development of Via in Mold (ViM) for embedded wafer level package (EWMLP)

Soon Wee Ho, Ser Choong Chong, Hyoung Joon Kim, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Design, process integration and characterization of wafer level vacuum packaging for MEMS resonator

Aibin Yu, Li Shiah Lim, C S Premachandran, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Effects of TSV (Through Silicon Via) interposer/chip on the thermal performances of 3D IC packaging

John H. Lau, Tai Chong Chai, Kripesh Vaidyanathan, 2009 .