Hai Ren
发表
Li Ran,
Zheng Zeng,
Hua Lu,
2017,
IEEE Transactions on Device and Materials Reliability.
Novel cooling technology to reduce thermal impedance and thermomechanical stress for SiC application
Hui Li,
Qing Ma,
Li Ran,
2017,
2017 IEEE Applied Power Electronics Conference and Exposition (APEC).
Hui Li,
Minyou Chen,
Wei Lai,
2019,
IEEE Journal of Emerging and Selected Topics in Power Electronics.
Hui Li,
Jinyuan Li,
Wei Lai,
2019,
IEEE Transactions on Electron Devices.