M. Hrovat

An Introduction of RoHS Legislation in SMD Thick-Film Hybrid Technology - a Case Study

D. Belavic, D. Rocak, J.F. Plut, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Thick-film piezoresistors - benchmarking of LTCC substrates

D. Belavic, M. Hrovat, K. Makarovic, 2012, 2012 35th International Spring Seminar on Electronics Technology.

Program of Research and Development on the THORIUM UTILIZATION IN PWRS : Final Report (1979-1988)

H. Finnemann, B. G. Brodda, M. Hrovat, 1989 .

Design of a Capacitive LTCC-based Pressure Sensor

P. Svasta, D. Belavic, M. Hrovat, 2009, 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME).

Thick-film materials for heat flux sensors

M. Hrovat, D. Belavič, M. Zgonik, 1992 .

Characterization of PZT thick films fired on LTCC substrates

M. Hrovat, A. Dziedzic, J. Holc, 2003 .

Microstructural and electrical characteristics of some “overfired” thick-film resistors

M. Hrovat, J. Holc, D. Belavič, 2001 .

LTCC resistors and resistive temperature sensors - chosen electrical and stability properties

D. Belavic, M. Hrovat, A. Dziedzic, 2005, 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005..

Capacitive pressure sensors realized with LTCC technology

D. Belavic, M. Hrovat, S. Macek, 2008, 2008 31st International Spring Seminar on Electronics Technology.

The development of microstructural and electrical characteristics in some thick-film resistors during firing

M. Hrovat, J. Holc, D. Belavič, 2002 .

Correlation between microstructure and gauge factors of thick film resistors

M. Hrovat, J. Holc, D. Belavič, 1995 .

An investigation of thick-film resistor, fired at different temperatures, for strain sensors

D. Belavic, M. Hrovat, J. Holc, 2001, 24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492).