X. J. Zhao

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

Yi-Shao Lai, N. Owens, Ranjan Rajoo, 2009 .

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

Yi-Shao Lai, N. Owens, D. R. Frear, 2008 .

Prediction of moisture induced failures in flip chip on flex interconnections with non-conductive adhesives

C. K. Ong, Ram Ranjan, Ee Hua Wong, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Stress–strain characteristics of tin-based solder alloys at medium strain rate

Yi-Shao Lai, N. Owens, D. R. Frear, 2008 .

Assembly process modeling for flip chip on flex interconnections with non-conductive adhesive

M. K. Iyer, Ranjan Rajoo, Xiaowu Zhang, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).