John A. Patten

发表

Extreme negative rake angle technique for single point diamond nano-cutting of silicon

J. Patten, Wei Gao, John A. Patten, 2001 .

SINGLE POINT DIAMOND TURNING EFFECTS ON SURFACE QUALITY AND SUBSURFACE DAMAGE IN CERAMICS

Jun Qu, Deepak Ravindra, J. Patten, 2009 .

Ductile regime material removal of silicon carbide (SIC)

Deepak Ravindra, J. Patten, Deepak Ravindra, 2011 .

Ductile Regime Nanomachining of Single-Crystal Silicon Carbide

J. Patten, Wei Gao, Wei Gao, 2005 .

Origins of the Ductile Regime in Single-Point Diamond Turning of Semiconductors

D. L. Callahan, Ronald O. Scattergood, J. Patten, 1995 .

NUMERICAL SIMULATIONS OF DUCTILE MACHINING OF SILICON NITRIDE WITH A CUTTING TOOL OF DEFINED GEOMETRY

Troy D. Marusich, Harish P. Cherukuri, J. Patten, 2001 .

Single Point Diamond Turning of CVD Coated Silicon Carbide

Jerry Jacob, J. Patten, B. Bhattacharya, 2006 .

Electrical and Optical Detection and Heating of the High Pressure Metallic Phase of Silicon In-situ During Scratching with Diamond and its effect on the material ’ s hardness

Lei Dong, Jimmie A. Miller, John A. Patten, 2003 .

Estimation of Temperature Distribution in Silicon During Micro Laser Assisted Machining

Lei Dong, Kamlesh J. Suthar, Hisham A. Abdel-Aal, 2008 .

On the thermal aspects of ductile regime micro-scratching of single crystal silicon for NEMS/MEMS applications

Lei Dong, Hisham A. Abdel-Aal, John A. Patten, 2005 .