J.K.L. Lai

Comparative study of micro-BGA reliability under bending stress

Y. C. Chan, K. C. Hung, P. L. Tu, 2000 .

Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints

Y. C. Chan, Y. Chan, A. So, 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

A review of precipitation behaviour in AISI type 316 stainless steel

J. Lai, J.K.L. Lai, 1983 .

The effect of solder paste viscosity on porosity and mechanical properties of surface mount solder joints

Y. C. Chan, Y. Chan, J. Lai, 1997 .

Porosity formation and its effects on mechanical properties of SMT solder joints

I. K. Hui, D. J. Xie, Y. C. Chan, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints

Y. C. Chan, P. L. Tu, P. Tu, 1997 .

Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method

Li Wang, J. Lai, Chi‐Man Lawrence Wu, 2005 .

Residual shear strength of Sn-Ag and Sn-Bi lead-free SMT joints after thermal shock

Y. C. Chan, Y. Chan, J. Lai, 2000 .

Effects of bond temperature and pressure on microstructures of tape automated bonding (TAB) inner lead bonds (ILB) with thin tape metallization

J. Lai, J.K.L. Lai, M. C. Loo, 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.