J.L. Prince

An all purpose dispersive multiconductor interconnect model compatible with PRIMA

S. Pasha, A.C. Cangellaris, J.L. Prince, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Simultaneous switching noise: influence of plane-plane and plane-signal trace coupling

A. Vaidyanath, B. Thoroddsen, A.C. Cangellaris, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

Effect of device and interconnect scaling on the performance and noise of packaged CMOS devices

R. Senthinathan, J.L. Prince, 1990, IEEE Proceedings of the Custom Integrated Circuits Conference.

Simulation of transients in VLSI packaging interconnections

A.C. Cangellaris, J.L. Prince, O.A. Palusinski, 1989, Proceedings., 39th Electronic Components Conference.

A broadband CPW-to-microstrip via-less transition for on wafer package probing applications

K. Melde, J.L. Prince, L. Zhu, 2003, Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710).

Effect of floating conductive plane on effective inductance

J.L. Prince, M. Lopez, 1997, Electrical Performance of Electronic Packaging.

Parametric study of a VLSI plastic package using locally refined finite element models

J. R. Umaretiya, Z. J. Staszak, B. Simon, 1989, Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

Frequency-dependent inductance and resistance calculation for three-dimensional structures in high-speed interconnect systems

A.C. Cangellaris, J.L. Prince, J. Prince, 1989, Proceedings., 39th Electronic Components Conference.

Triangle impulse response (TIR) calculation for lossy transmission line simulation

Tingdong Zhou, Zhaoqing Chen, S. Dvorak, 2001, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).

Transient Simulation of Lossy Interconnects Based on a Dispersive Hybrid Phase-Pole Macromodel

S.L. Dvorak, J.L. Prince, Bing Zhong, 2007, IEEE Transactions on Advanced Packaging.