M. Feil
发表
K. Bock,
K. Bock,
A. Drost,
2005,
Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..
K. Bock,
M. Feil,
M. Konig,
2006,
2006 1st Electronic Systemintegration Technology Conference.
K. Bock,
G. Klink,
M. Feil,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
G. Klink,
M. Feil,
M. Konig,
2001,
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
K. Bock,
K. Bock,
M. Feil,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).