Haedo Jeong

发表

Mathematical model-based evaluation methodology for environmental burden of chemical mechanical planarization process

David Dornfeld, D. Dornfeld, Hyunseop Lee, 2014 .

Investigation of Pad Surface Topography Distribution for Material Removal Uniformity in CMP Process

Ki-Hyun Park, Haedo Jeong, Haedo Jeong, 2008 .

The effects of a spray slurry nozzle on copper CMP for reduction in slurry consumption

Dasol Lee, Hyunseop Lee, Haedo Jeong, 2015 .

Development of green CMP by slurry reduction through controlling platen coolant temperature

Hyoungjae Kim, Hyunseop Lee, Haedo Jeong, 2015 .

Evaluation of micro-replication technology using silicone rubber molds and its applications

David Dornfeld, Sung-Il Chung, Yong-Gwan Im, 2003 .

Planarization of wafer edge profile in chemical mechanical polishing

Hobin Jeong, Yeongbong Park, Hobin Jeong, 2013 .

Analysis of pressure distribution and verification of pressure signal by changes load and velocity in chemical mechanical polishing

Jae-Hong Park, Masaharu Kinoshita, Changsuk Lee, 2015 .

The application of micro-groove machining for the mold of PDP barrier ribs

Sang-Cheol Jeong, Haedo Jeong, Sang-Cheol Jeong, 2001 .

Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw

Sangjik Lee, Hyoungjae Kim, Haedo Jeong, 2015 .

A Study on Frictional Characteristics and Polishing Result of SiO2Slurry in CMP

Sukhoon Jeong, Hyunseop Lee, Haedo Jeong, 2005 .

Chemical and mechanical balance in polishing of electronic materials for defect-free surfaces

H. S. Lee, Haedo Jeong, Haedo Jeong, 2009 .

Effect of pad groove geometry on material removal characteristics in chemical mechanical polishing

Hyunseop Lee, Youngkyung Lee, Haedo Jeong, 2012 .

Effect on Two-Step Polishing Process of Electrochemical Mechanical Planarization and Chemical–Mechanical Planarization on Planarization

Sukhoon Jeong, Hyoungjae Kim, Haedo Jeong, 2009 .

Mechanical effect of colloidal silica in copper chemical mechanical planarization

Hyunseop Lee, Haedo Jeong, Hyunseop Lee, 2009 .

Experimental Investigation of Material Removal Characteristics in Silicon Chemical Mechanical Polishing

David Dornfeld, Sukhoon Jeong, Hyoungjae Kim, 2009 .

Temperature distribution in polishing pad during CMP process: Effect of retaining ring

Hyunseop Lee, Haedo Jeong, Yongchang Guo, 2012 .

Correlation between break-in characteristics and pad surface conditions in silicon wafer polishing

Jae-Hong Park, Ki-Hyun Park, Haedo Jeong, 2008 .

Chemical Mechanical Planarization Method for Thick Copper Films of Micro-Electro-Mechanical Systems and Integrated Circuits

Hyoungjae Kim, Hyunseop Lee, Haedo Jeong, 2008 .

Prediction of Real Contact Area from Microtopography on CMP Pad

Hobin Jeong, Hyunseop Lee, Haedo Jeong, 2012 .

Influence of slurry components on uniformity in copper chemical mechanical planarization

Hyunseop Lee, Haedo Jeong, Hyunseop Lee, 2008 .

Chemical Mechanical Polishing of a Ti-Si-N Nanocomposite and AFM Study on Its Nanostructure

Kwang Ho Kim, Hyunseop Lee, Haedo Jeong, 2010 .

Effect of diluted colloidal silica slurry mixed with ceria abrasives on CMP characteristic

Yong-Jin Seo, Y. Seo, Hojun Lee, 2016 .

Study on heat transfer in super-high-speed grinding: energy partition to the workpiece in HEDG

G. Q. Cai, Haedo Jeong, N. K. Kim, 2001 .

Application of electrolytic in-process dressing (ELID) grinding and chemical mechanical polishing (CMP) process for emerging hard-brittle materials used in light-emitting diodes

Hitoshi Ohmori, Hiroshi Kasuga, H. Ohmori, 2011 .

Effect of surfactant on package substrate in chemical mechanical planarization

Jae-Hong Park, Haedo Jeong, Jae-Hong Park, 2015 .

A study on microreplication of real 3D-shape structures using elastomeric mold: from pure epoxy to composite based on epoxy

Dong-Woo Cho, Sung-Il Chung, D. Cho, 2004 .

A wafer-scale material removal rate profile model for copper chemical mechanical planarization

Hyunseop Lee, Haedo Jeong, Hyunseop Lee, 2011 .

Experimental investigation of process parameters for roll-type linear chemical mechanical polishing (Roll-CMP) system

Jae-Hong Park, Hyunseop Lee, Haedo Jeong, 2014 .

Mathematical modeling of CMP conditioning process

Ki-Hyun Park, Hyoungjae Kim, Haedo Jeong, 2007 .

Development of linear roll CMP system for large area micropatterns

Changsuk Lee, Haedo Jeong, Seongsoo Kim, 2012 .

Mechanical effects of polishing pad in copper electrochemical mechanical deposition for planarization

Sukhoon Jeong, Sangjik Lee, Hyoungjae Kim, 2010 .

A Study on Novel Conditioning for CMP

Hyoungjae Kim, Sunghoon Ivan Lee, Haedo Jeong, 1999 .

Heat and its effects to chemical mechanical polishing

Hyoungjae Kim, Daehee Kwon, Haedo Jeong, 2006 .

The influence of abrasive size on high-pressure chemical mechanical polishing of sapphire wafer

Sangjik Lee, Hyoungjae Kim, Haedo Jeong, 2015 .

Effect of Process Parameters on Friction Force and Material Removal in Oxide Chemical Mechanical Polishing

Hyoungjae Kim, Young-Jin Kim, Hyunseop Lee, 2008 .

Effect of mechanical factor in uniformity for electrochemical mechanical planarization

Sukhoon Jeong, Hyoungjae Kim, Hyunseop Lee, 2010 .

Analysis of removal mechanism on oxide CMP using mixed abrasive slurry

Hojun Lee, Haedo Jeong, Haedo Jeong, 2015 .

Effect of wafer size on material removal rate and its distribution in chemical mechanical polishing of silicon dioxide film

Sangjik Lee, Yeongbong Park, Hyunseop Lee, 2013 .

CMP Pad Break-in Time Reduction in Silicon Wafer Polishing

Kyu-Kab Cho, Haedo Jeong, Kyu-Kab Cho, 2007 .

Stability and Improvement of Polishing Pad in W CMP

Jae-Hong Park, Masaharu Kinoshita, Koichi Yoshida, 2007 .

The Effect of Slurry Flow Rate and Temperature on CMP Characteristic

김형재, Haedo Jeong, Haedo Jeong, 2004 .

Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes

David Dornfeld, H. S. Lee, D. Dornfeld, 2013 .

Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry

Ki-Hyun Park, Hyoungjae Kim, Hyunseop Lee, 2008 .