J. Wilde

Low-cost deformable mirror for laser focussing

W. Greger, T. Hösel, T. Fellner, 2006, SPIE Optics East.

Harsh environment application of electronics - Reliability of copper wiring and testability thereof

R. Bauer, J. Wilde, S. Rathgeber, 2012, Microelectron. Reliab..

Steinaker Gap (42Un2004) Monitor and Excavation

R. Talbot, J. Wilde, 1993 .

Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting

J. Wilde, Stefan Martens, B. Krueger, 2008, Microelectron. Reliab..

Reliability of Chip/DCB Solder Joints in AlSiC Base Plate Power Modules: Influence of Chip Size

M. Thoben, J. Wilde, X. Xie, 2001, Microelectronics and reliability.

Development and Testing of Cold gas Sprayed Circuit Boards for Power Electronics Applications

J. Wilde, J. Wilde, T. Grund, 2012, 2012 7th International Conference on Integrated Power Electronics Systems (CIPS).

Analyzing Parameters Influencing Stress and Drift in Moulded Hall Sensors

T. Fellner, J. Wilde, R. Janke, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Die-attachment technologies for high-temperature applications of Si and SiC-based power devices

J. Wilde, A. A. Bajwa, E. Moller, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Influence of materials data on the performance modelling in the design of MEMS packages

J. Wilde, E. Zukowski, S. Fischer, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

Mechanical Characterization of Polycrystalline and Amorphous Silicon Carbide Thin Films Using Bulge Test

J. Wilde, J. Wilde, H. Reinecke, 2013, Journal of Microelectromechanical Systems.