Jui-Chin Chen

Oxide Liner, Barrier and Seed Layers, and Cu-Plating of Blind Through Silicon Vias (TSVs) on 300mm Wafers for 3D IC Integration

John H. Lau, Ming-Jer Kao, Tzu-Kun Ku, 2011 .

Effects of etch rate on scallop of through-silicon vias (TSVs) in 200mm and 300mm wafers

John H. Lau, Ming-Jer Kao, Tzu-Kun Ku, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Design, fabrication, and calibration of stress sensors embedded in a TSV interposer in a 300mm wafer

Sheng-Tsai Wu, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

A thermal performance measurement method for blind through silicon vias (TSVs) in a 300mm wafer

John H. Lau, Heng-Chieh Chien, Ming-Ji Dai, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Process integration of 3D Si interposer with double-sided active chip attachments

John H. Lau, Ming-Jer Kao, Tzu-Kun Ku, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Backside-TSV process development and integration for 2∼3um small size TSV

Chung-Chih Wang, Yiu-Hsiang Chang, Tsuen-Sung Chen, 2016, 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).