Guotao Wang

Packaging effects on reliability of Cu/low-k interconnects

Paul S. Ho, Steven K. Groothuis, P. Ho, 2003 .

A study of electromigration failure in Pb-free solder joints

Peng Su, Min Ding, P. Ho, 2005, 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual..

Effect of contact metallization on electromigration reliability of Pb-free solder joints

Peng Su, Paul S. Ho, Min Ding, 2006 .

Effects of dielectric material and linewidth on thermal stresses of Cu line structures

Paul S. Ho, Guotao Wang, Dongwen Gan, 2002, Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).

Copper die bumps (first level interconnect) and low-K dielectrics in 65nm high volume manufacturing

S. Balakrishnan, C. Pelto, G. Leatherman, 2006, 56th Electronic Components and Technology Conference 2006.

Thermal stress and debonding in Cu/low k damascene line structures

Paul S. Ho, P. Ho, Guotao Wang, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Effect of packaging on interfacial cracking in Cu/ low k Damascene structures

Paul S. Ho, S. Groothuis, P. Ho, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Thermal deformation analysis on flip-chip packages using high resolution moire interferometry

Paul S. Ho, Min Ding, P. Ho, 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

Reliability challenges and recent advances for Cu interconnects

Ki-Don Lee, P. Ho, Ki-Don Lee, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.