B. Chambers

Thermal performance of power packages-single-inline package as a case study

B. Chambers, M. Mahilingam, 1992, [1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

STEADY STATE AND TRANSIENT THERMAL ANALYSIS OF CHIP SCALE PACKAGES

B. Chambers, Tien-Yu Tom Lee, William R. Blood, 1999 .

Thermal analysis of a chip scale package technology

B. Chambers, Tien-Yu Tom Lee, William R. Blood, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Thermal performance limits of the QFP family

B. Chambers, Howard M. Berg, V. Hause, 1993, [1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

An assessment of the thermal performance of the PBGA family

B. Chambers, M. Mahalingam, S. Mulgaonker, 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

Application of CFD Technology to electronic thermal management

B. Chambers, M. Mahalingam, Tien-Yu Tom Lee, 1994 .

A Numerical Study of Local and Average Natural Convection Nusselt Numbers for Simultaneous Convection Above and Below a Uniformly Heated Horizontal Thin Plate

B. Chambers, T. Lee, Tien-Yu T. Lee, 1997 .

Application of CFD Technology to electronic thermal management

B. Chambers, M. Mahalingam, T. Lee, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.