H. Kristiansen

Ontology for the anisotropic conductive adhesive interconnect technology for electronics packaging applications

J. Liu, Yu Wang, J. Morris, 2005, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.

Thermal resistance, thermomechanical stress and thermal cycling endurance of silicon chips bonded with adhesives

H. Kristiansen, A. Bjorneklett, T. Tuhus, 1993, [1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

Heat transfer in evaporation in dielectric liquid films in different atmospheres using silicon testchips

H. Kristiansen, A. Bjorneklett, 1993, [1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

Industrial Microelectronics towards the Year 2000

Oddvar Søråsen, H. von der Lippe, H. Kristiansen, 1993 .

Overview of conductive adhesive interconnection technologies for LCD's

J. Liu, H. Kristiansen, 1997 .

A model for thermal fatigue of large area adhesive joints between materials with dissimilar thermal expansion

H. Kristiansen, A. Bjorneklett, T. Tuhus, 1994, Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

Thermal conductivity of epoxy adhesives filled with silver particles

H. Kristiansen, A. Bjorneklett, L. Halbo, 1992 .

Failure analysis of thermally and mechanically stressed plastic core solder balls

H. Kristiansen, L. Hoff, D. N. Wright, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

A study on the evaporation heat transfer in the cooling of high power electronics

H. Kristiansen, A. Bjorneklett, T. Fallet, 1994, Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

FLOW BOILING HEAT TRANSFER OF ELECTRONIC CHIPS IN HORIZONTAL CHANNELS

H. Kristiansen, H. Kristiansen, M. Gulliksen, 1995 .

Overview of conductive adhesive interconnection technologies for LCD's

H. Kristiansen, J. Liu, H. Kristiansen, 1997, Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).