Ke Xue

Warpage prediction of fine pitch BGA by finite element analysis and shadow moiré technique

Ke Xue, Jingbo Gai, Jingshen Wu, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

The Influence of Molding Compound Properties on System-in-Package Reliability for 5G Application

Jingshen Wu, Ke Xue, Dong Lu, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

Characteristics of large diameter rock-socketed piles under lateral loads

Ke Xue, Ke Xue, 2007 .

Reliability based design optimization for fine pitch ball grid array: Modeling construction and DOE analysis

Angus Lam, Ke Xue, Haibin Chen, 2009, 2009 11th Electronics Packaging Technology Conference.

Thermal and reliability analysis of clip bonding package using high thermal conductivity adhesive

Jingshen Wu, Yejun Zhu, Haibin Chen, 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).

System-in-package design using multi-task memetic learning and optimization

Ke Xue, Weijing Dai, Zhenkun Wang, 2021, Memetic Computing.

The Finite Element Model of the Effect of the Interface Behavior of Corner Bond on the Reliability of the BGA Package under Thermal Cycling

Jingshen Wu, Jinglei Yang, Haibin Chen, 2020, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

Implementing Ensemble Learning to Predict Temperature Variables of Power Electronics Devices

Ke Xue, Weijing Dai, Dong Lu, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Wire sweep study for SOT package array matrix molding with simulation and experimental analysis

Ke Xue, Haibin Chen, Jiale Han, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Determination of Parameters in Mixed-Mode Cohesive Zone Models for Modified Button Shear Tests by Particle Swarm Optimization

Ke Xue, Weijing Dai, Dashun Liu, 2021, International Conference on Electronic Packaging Technology.