Jingbo Gai

发表

Ke Xue, Jingbo Gai, Jingshen Wu, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Jingbo Gai, Xuejiao Du, Caihong Zhou, 2021, 2021 3rd International Conference on System Reliability and Safety Engineering (SRSE).

Angus Lam, Ke Xue, Haibin Chen, 2009, 2009 11th Electronics Packaging Technology Conference.

Yifan Hu, Jingbo Gai, Junxian Shen, 2019, Shock and Vibration.