A. Lam
发表
Ke Xue,
Jingbo Gai,
Jingshen Wu,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
M. Yam,
Xu-hong Zhou,
A. Lam,
2020,
Smart Materials and Structures.
M. Yam,
Yanyang Zhang,
V. Iu,
2016
.
J. J. Cheng,
A. Lam,
Michael C.H. YamM.C.H. Yam,
2007
.
Wei Wang,
Michael C.H. Yam,
Vai Pan Iu,
2015
.
Binhui Jiang,
M. Yam,
A. Lam,
2020
.
M. Yam,
A. Lam,
Xuemei Lin,
2020
.
A. Corigliano,
Chayanon Hansapinyo,
Zhitao Yan,
2021
.
Michael C.H. Yam,
Vai Pan Iu,
Angus C.C. Lam,
2009
.
Binhui Jiang,
M. Yam,
A. Lam,
2020
.
M. Yam,
A. Lam,
K. Ke,
2018,
Journal of Constructional Steel Research.
M. Yam,
A. Lam,
K. Chung,
2015
.
Michael C.H. Yam,
Angus C.C. Lam,
Cheng Fang,
2014
.
Angus C.C. Lam,
Michael C.H. Yam,
Cheng Fang,
2015
.
Michael C.H. Yam,
Vai Pan Iu,
Angus C.C. Lam,
2007
.
Angus C.C. Lam,
Michael C.H. Yam,
Cheng Fang,
2015
.
M. Yam,
A. Lam,
K. Ke,
2022,
Thin-Walled Structures.
Angus Lam,
Ke Xue,
Haibin Chen,
2009,
2009 11th Electronics Packaging Technology Conference.
Angus C.C. Lam,
Ke Ke,
Michael C.H. Yam,
2019,
Thin-Walled Structures.
Michael C.H. Yam,
Angus C.C. Lam,
Cheng Fang,
2017
.
Michael C.H. Yam,
Angus C.C. Lam,
Cheng Fang,
2017
.