A. Kessler
发表
M. Stecher,
K. Jansen,
C. Bohm,
2008,
2008 58th Electronic Components and Technology Conference.
K. Jansen,
C. Bohm,
J. de Vreugd,
2008,
2008 10th Electronics Packaging Technology Conference.
M. Stecher,
P. Alpern,
H. Gunther,
2009,
IEEE Transactions on Device and Materials Reliability.
On the Way to Zero Defect of Plastic-Encapsulated Electronic Power Devices—Part II: Molding Compound
M. Stecher,
A. Kessler,
R. Tilgner,
2009,
IEEE Transactions on Device and Materials Reliability.
M. Stecher,
P. Alpern,
H. Gunther,
2009,
IEEE Transactions on Device and Materials Reliability.
M. Stecher,
C. Qian,
K. Jansen,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.