R. V. Silfhout

Virtual qualification of moisture induced failures of advanced packages [IC packages]

W. Driel, G. Zhang, J. Janssen, 2004 .

Molecular simulation strategy for mechanical modeling of amorphous/porous low-dielectric constant materials

W. Driel, Guoqi Zhang, C. Yuan, 2008 .

Chemical–mechanical relationship of amorphous/porous low-dielectric film materials

W. Driel, Guoqi Zhang, C. Yuan, 2008 .

Prediction of crack growth in IC passivation layers

Willem D. van Driel, G. Q. Zhang, Leo J. Ernst, 2004, Microelectron. Reliab..

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

Willem D. van Driel, G. Q. Zhang, C. J. Liu, 2004, Microelectron. Reliab..

Virtual qualification of moisture induced failures of advanced packages [IC packages]

Willem D. van Driel, G. Q. Zhang, H. J. L. Bressers, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

State-of-the-Art on Thermo-Mechanical Modelling of IC Back-End Processes

W. D. van Driel, R. van der Weerd, Fred G. Kuper, 2001 .

Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion

Willem D. van Driel, Olaf van der Sluis, R. A. B. Engelen, 2007, Microelectron. Reliab..

Prediction of Delamination Related IC & Packaging Reliability Problems

Willem D. van Driel, G. Q. Zhang, Richard B. R. van Silfhout, 2005, Microelectron. Reliab..