S. Chiu

发表

Characterization of additive systems for damascene Cu electroplating by the superfilling profile monitor

Jia-Min Shieh, Bau-Tong Dai, Shih-Chieh Chang, 2000 .

Flow characterization and mixing performance of weakly-shear-thinning fluid flows in a microfluidic oscillator

Chen-li Sun, S. Chiu, Yu Jen Lin, 2017 .

Deposition temperature effects of high density plasma chemical vapor deposition films for subquarter micron devices application

You-Lin Wu, Ying-Lang Wang, S. Chiu, 1999 .

The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer

C. Ay, Chuan-Pu Liu, Ying-Lang Wang, 2003 .

Nitric acid-based slurry with citric acid as an inhibitor for copper chemical mechanical polishing

S. Chiu, M. Feng, I. Tung, 1999 .

Palladium seeding on the tantalum-insulated silicon oxide film by plasma immersion ion implantation for the growth of electroless Copper

H. Shih, Chien-Cheng Lin, S. Chiu, 2000 .

Application of plasma immersion ion implantation on seeding copper electroplating for multilevel interconnection

Ying-Lang Wang, Shih-Chieh Chang, S. Chiu, 2005 .

High-selectivity damascene chemical mechanical polishing

Ying-Lang Wang, Shih-Chieh Chang, S. Chiu, 2006 .