Hung-Chun Tsai

Modeling and Experimental Analysis of the Material Removal Rate in the Chemical Mechanical Planarization of Dielectric Films and Bare Silicon Wafers

Hong Hocheng, H. Hocheng, Hung-Chun Tsai, 2001 .

Interface Chemistry and Adhesion Strength Between Porous SiOCH Low-k Film and SiCN Layers

Su-Jien Lin, Shou-Yi Chang, Hung-Chun Tsai, 2008 .

Effect of plasma treatments on interface adhesion between SiOCH ultra-low-k film and SiCN etch stop layer

Shou-Yi Chang, Shou-Yi Chang, Hung-Chun Tsai, 2008 .

Instability of gold oxide Au2O3

Hung-Chun Tsai, Yee-Shyi Chang, Yee-shyi Chang, 2003 .