A. Chaloupka

发表

Design, fabrication and embedding of microscale interdigital sensors for real-time cure monitoring during composite manufacturing

W. Lang, M. K. Moghaddam, Arne Breede, 2016 .

Phase Change Detection in Neat and Fiber Reinforced Polyamide 6 Using Dielectric Analysis

A. Wedel, K. Drechsler, N. Rudolph, 2015 .

Quasi‐isothermal DSC testing of epoxy adhesives using initial fast heating rates

N. Rudolph, T. Osswald, A. Chaloupka, 2017 .

Dielectric analysis monitoring of thermoset curing with ionic liquids: From modeling to the prediction in the resin transfer molding process

V. Altstädt, A. Chaloupka, S. Schmölzer, 2019, Polymer Composites.

TTT-diagram for epoxy film adhesives using quasi-isothermal scans with initial fast ramps

N. Rudolph, T. Osswald, A. Chaloupka, 2018 .

Moduli development of epoxy adhesives during cure

N. Rudolph, T. Osswald, A. Chaloupka, 2019, Polymer Testing.

Development of a dielectric sensor for the real-time in-mold characterization of carbon fiber reinforced thermosets

A. Chaloupka, 2018 .

Isothermal anionic polymerization of ε‐caprolactam to polyamide‐6: Kinetic modeling and application for production process

A. Chaloupka, Samet Kurt, S. Horn, 2023, Journal of Applied Polymer Science.