D. Esler

Design of a high reliability and low thermal resistance interface material for microelectronics

A. Gowda, A. Zhong, D. Esler, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Voids in thermal interface material layers and their effect on thermal performance

K. Srihari, A. Gowda, S. Tonapi, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

Utilization of carbon fibers in thermal management of microelectronics

H. Zhong, A. Gowda, D. Esler, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

Reliability testing of silicone-based thermal greases [IC cooling applications]

K. Srihari, A. Gowda, S. Tonapi, 2005, Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005..

1.2kV class SiC MOSFETs with improved performance over wide operating temperature

P. Losee, L. Stevanovic, A. Johnson, 2014, 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD).

SiC MOSFET design considerations for reliable high voltage operation

R. Ghandi, L. Stevanovic, A. Bolotnikov, 2017, 2017 IEEE International Reliability Physics Symposium (IRPS).

High Performance 1.2kV-2.5kV 4H-SiC MOSFETs with Excellent Process Capability and Robustness

Ljubisa Dragoljub Stevanovic, James W. Kretchmer, Thomas Bert Gorczyca, 2016 .