B. Flechet

发表

Presentation of a new time domain simulation tool and application to the analysis of advanced interconnect performance dependence on design and process parameters

B. Blampey, A. Farcy, O. Cueto, 2004, Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects.

A complete calibration procedure for time domain network analyzers

B. Flechet, P. Ferrari, G. Angenieux, 1992, 1992 IEEE Microwave Symposium Digest MTT-S.

Rise time reduction of high speed digital signals on interconnects of the CMOS 45 nm node by optimizing interconnect inductance

A. Farcy, T. Lacrevaz, B. Flechet, 2009, 2009 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC).

Effects of silicon substrate coupling phenomena on signal integrity for RF or high speed communications in 3D-IC

A. Farcy, T. Lacrevaz, B. Flechet, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Characterization of lossy transmission lines of arbitrary characteristic impedance by time domain measurements

P. Ferrari, B. Flechet, G. Angenieux, 1993, 1993 23rd European Microwave Conference.

Keep on shrinking interconnect size: Is it still the best solution?

D. Deschacht, A. Farcy, T. Lacrevaz, 2010, 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).

Microwave characterization of integrated and multilayered directional couplers for wireless communication applications

B. Flechet, G. Angenieux, P. Fortin, 1999, 1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282).

Caractérisation in-situ jusqu'à 100 GHz d'isolants utilisés dans les nouvelles technologies 3D de type "System in Package on Board" (SiPoB)

Thierry Lacrevaz, Cedric Bermond, B. Flechet, 2020 .

Evaluation of 3D interconnect routing and stacking strategy to optimize high speed signal transmission for memory on logic

C. Ferrandon, S. Capraro, A. Farcy, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Benefit on interconnect performance of a relaxed wire density in a 45 nm node of the Back End of Line

D. Deschacht, A. Farcy, T. Lacrevaz, 2010, 2010 IEEE 14th Workshop on Signal Propagation on Interconnects.

Delay and Crosstalk on Future 32 nm Node Interconnects: Impact of ULK-Air-Gap Architecture

B. Blampey, O. Cueto, B. Flechet, 2006, 2006 IEEE Workship on Signal Propagation on Interconnects.

Experimental characterization of dummies impact on interconnects propagation performance. Optimization of dummy sizes for the CMOS 22 nm technology node

B. Blampey, B. Flechet, M. Gallitre, 2008, 2008 12th IEEE Workshop on Signal Propagation on Interconnects.

Electrical characterization and impact on signal integrity of new basic interconnection elements inside 3D integrated circuits

C. Ferrandon, S. Capraro, A. Farcy, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Fullwave description of propagation and losses in quasiplanar transmission lines by quasi-analytical solution

B. Flechet, G. Angenieux, J.-W. Tao, 1993, 1993 IEEE MTT-S International Microwave Symposium Digest.

Simulation of signal propagation with prospective air gap architectures as potential solutions to achieve Moore's law for the 32 nm node and below Cu Introduction of ULK

B. Blampey, B. Flechet, J. Torres, 2006, 2006 International Interconnect Technology Conference.

Distributed model of two-level asymmetrical PCB interconnect tree

B. Ravelo, T. Lacrevaz, B. Flechet, 2013, 2013 International Symposium on Electromagnetic Compatibility.

Effective interconnect networks design in CMOS 45 nm circuits to joint reductions of XT and delay for transmission of very high speed signals

D. Deschacht, A. Farcy, T. Lacrevaz, 2010, 2010 IEEE Electrical Design of Advanced Package & Systems Symposium.

Refined but handy electrical models of TSV usable from low to high density and for RF or fast digital signals in 3D-IC

A. Farcy, T. Lacrevaz, B. Flechet, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

3D Integration of CMOS image sensor with coprocessor using TSV last and micro-bumps technologies

G. Cibrario, R. Franiatte, A. Farcy, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

A simple and systematic method for the design of tapered nonlinear transmission lines

B. Flechet, G. Angenieux, J.W. Tao, 1998, 1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192).

Characterization and simulation of signal propagation and crosstalk on advanced Cu-SiO/sub 2/ on-chip interconnects for high speed circuits

V. Arnal, Y. Morand, A. Farcy, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Capacitive impacts of dummies on interconnect propagation performances for integrated circuits of the 65 nm node and below

B. Blampey, A. Farcy, O. Cueto, 2005, Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005..

Time domain characterization of lossy arbitrary characteristic impedance transmission lines

P. Ferrari, B. Flechet, G. Angenieux, 1994, IEEE Microwave and Guided Wave Letters.

Characterization and modelling of Si-substrate noise induced by RF signal propagating in TSV of 3D-IC stack

R. Anciant, A. Farcy, T. Lacrevaz, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Innovative HF extraction procedure of the characteristic impedance for embedded planar transmission line on high conductive Si substrate

A. Farcy, T. Lacrevaz, B. Flechet, 2010, 2010 Asia-Pacific Microwave Conference.

Extraction of equivalent high frequency models for TSV and RDL interconnects embedded in stacks of the 3D integration technology

A. Farcy, T. Lacrevaz, B. Flechet, 2011, 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI).

Investigation on TSV impact on 65nm CMOS devices and circuits

J. Cluzel, A. Toffoli, G. Haury, 2010, 2010 International Electron Devices Meeting.

Optimization of signal propagation performances in interconnects of the 45 nm node by exhaustive analysis of the technological parameters impact

V. Arnal, J. Torres, B. Blampey, 2005, Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005..