R. Sidhu
发表
R. S. Sidhu,
Nikhilesh Chawla,
N. Chawla,
2006
.
R. S. Sidhu,
Nikhilesh Chawla,
N. Chawla,
2005
.
J. Pang,
Praveen Kumar,
I. Dutta,
2014
.
R. Mahajan,
I. Dutta,
J. Pang,
2010,
2010 12th Electronics Packaging Technology Conference.
N. Chawla,
R. Sidhu,
2008
.
R. S. Sidhu,
Nikhilesh Chawla,
N. Chawla,
2008
.
R. Mahajan,
R. Raj,
Praveen Kumar,
2011
.
R. S. Sidhu,
Nikhilesh Chawla,
N. Chawla,
2006
.
R. Sidhu,
R. Aspandiar,
D. Amir,
2011
.
R. S. Sidhu,
Nikhilesh Chawla,
N. Chawla,
2008
.
R. Mahajan,
I. Dutta,
Z. Huang,
2014,
Journal of Electronic Materials.
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates:
I. Effects of Loading and Processing Conditions
R. Mahajan,
J. Pang,
I. Dutta,
2012,
Journal of Electronic Materials.
R. Mahajan,
I. Dutta,
Z. Huang,
2012,
Journal of Electronic Materials.
R. S. Sidhu,
Nikhilesh Chawla,
N. Chawla,
2006
.
R. S. Sidhu,
Nikhilesh Chawla,
N. Chawla,
2004
.
R. Sidhu,
S. Elhalawaty,
K. Byrd,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
N. Chawla,
R. Sidhu,
Xin Deng,
2007
.
R. S. Sidhu,
Nikhilesh Chawla,
N. Chawla,
2006
.
R. S. Sidhu,
Nikhilesh Chawla,
R. Sidhu,
2006
.
R. Mahajan,
R. Raj,
I. Dutta,
2014,
Journal of Materials Science.
R. Mahajan,
Praveen Kumar,
I. Dutta,
2009
.