J. Moulet

Study of Ni-Si thin-film interfacial reactions by coupling differential scanning calorimetry measurements and transmission electron microscopy analyses

S. Oukassi, F. Hodaj, S. Lay, 2009 .

12 − μ m -Pitch Electromechanical Resonator for Thermal Sensing

M. Roukes, L. Duraffourg, J. Yon, 2018 .

III-V Multi-Junction Metal-Wrap-through (MWT) Concentrator Solar Cells

F. Dimroth, T. Salvetat, E. Oliva, 2016 .

1 Array of Resonant Electromechanical Nanosystems : A 2 Technological Breakthrough for Uncooled Infrared 3 Imaging 4

J. Arcamone, L. Duraffourg, J. Yon, 2018 .

Array of Resonant Electromechanical Nanosystems: A Technological Breakthrough for Uncooled Infrared Imaging

J. Arcamone, L. Duraffourg, J. Yon, 2018, Micromachines.

High piezoelectric properties in LiNbO3 transferred layer by the Smart Cut™ technology for ultra wide band BAW filter applications

C. Mazure, B. Ghyselen, L. Clavelier, 2008, 2008 IEEE International Electron Devices Meeting.

III-V multi-junction solar cell using metal wrap through contacts

F. Dimroth, T. Salvetat, E. Oliva, 2016 .

3-inch single-crystal LiTaO/sub 3/films onto metallic electrode using Smart Cut/sup TM/technology

M. Yoshimi, L. Clavelier, M. Zussy, 2008 .

Large Qxf product for HBAR using Smart Cut ™ transfer of LiNbO3 thin layers onto LiNbO3 substrate

B. Ghyselen, D. Mercier, S. Ballandras, 2008, 2008 IEEE Ultrasonics Symposium.

Mode conversion in high overtone bulk acoustic wave resonators

B. Ghyselen, D. Mercier, S. Ballandras, 2009, 2009 IEEE International Frequency Control Symposium Joint with the 22nd European Frequency and Time forum.

300 mm InGaAs-on-insulator substrates fabricated using direct wafer bonding and the Smart Cut™ technology

H. Grampeix, S. Sollier, J. Widiez, 2016 .