R. Bornoff
发表
R. Bornoff,
A. Vass-Várnai,
B. Blackmore,
2017,
2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
R. Bornoff,
L. Gaal,
2019,
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
M. Rencz,
G. Farkas,
A. Poppe,
2019,
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Marta Rencz,
Robin Bornoff,
Andras Vass-Varnai,
2011,
2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP).
John Parry,
Robin Bornoff,
R. Bornoff,
2015,
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
R. Bornoff,
J. Parry,
Matthew J. Sapiano,
2020,
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
M. R. Mokhtarzadeh‐Dehghan,
R. Bornoff,
2001
.
Andras Poppe,
Robin Bornoff,
Gabor Farkas,
2019,
PROCEEDINGS OF the 29th Quadrennial Session of the CIE.
G. Farkas,
A. D. Bucchianico,
R. Bornoff,
2019,
2019 35th Semiconductor Thermal Measurement, Modeling and Management Symposium (SEMI-THERM).
Robin Bornoff,
Andras Poppe,
Genevieve Martin,
2019,
Energies.
Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources
Alessandro Magnani,
Lorenzo Codecasa,
Vincenzo d'Alessandro,
2018,
Microelectron. Reliab..
Wil H. A. Schilders,
James Dyson,
Robin Bornoff,
2017,
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
John Parry,
Robin Bornoff,
Byron Blackmore,
2011,
2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
Lorenzo Codecasa,
Vincenzo d'Alessandro,
John Parry,
2017,
Microelectron. Reliab..
Alessandro Magnani,
Lorenzo Codecasa,
Vincenzo d'Alessandro,
2017,
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
V. d'Alessandro,
A. Magnani,
L. Codecasa,
2016,
2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
V. d’Alessandro,
L. Codecasa,
R. Bornoff,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Robin Bornoff,
Gabor Farkas,
G. Farkas,
2018,
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
R. Bornoff,
W. Luiten,
2020,
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).