D. Riemer

Electrical equivalent method for thermal stress analysis

D. Riemer, 1989, Proceedings., 39th Electronic Components Conference.

High-Adhesion Thick-Film Gold Without Glass or Metal-Oxide Powder Additives

D. Riemer, 1985 .

Thermal-stress analysis with electrical equivalents

D. Riemer, 1990 .

Prediction of temperature cycling life for SMT solder joints on TCE-mismatched substrates

D. E. Riemer, D. Riemer, 1990, 40th Conference Proceedings on Electronic Components and Technology.

Cycle Life Prediction for SMT Solder Joints on TCE‐Mismatched Substrates

D. Riemer, 1990 .

The Theoretical Fundamentals of the Screen Printing Process

D. E. Riemer, D. Riemer, 1989 .