T. Enot
发表
N. Kernevez,
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2008 58th Electronic Components and Technology Conference.
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F. Fournel,
M. Pellat,
T. Enot,
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F. Fournel,
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2020
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F. Fournel,
P. Montméat,
T. Enot,
2018
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F. Fournel,
P. Montméat,
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F. Fournel,
P. Montméat,
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Materials Science in Semiconductor Processing.
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International Journal of Adhesion and Adhesives.
Collective Die-to-Wafer Self-Assembly for High Alignment Accuracy and High Throughput 3D Integration
F. Fournel,
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
N. Kernevez,
M. Zussy,
Zhihong Huang,
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2007 IEEE International Interconnect Technology Conferencee.
F. Fournel,
P. Montméat,
L. Sanchez,
2023,
Electronic Components and Technology Conference.
F. Fournel,
P. Montméat,
T. Enot,
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Microsystem Technologies.
Emmanuel Augendre,
Jochen Kraft,
Stephane Bernabe,
2014,
IEEE Journal of Selected Topics in Quantum Electronics.