A. Khairyanto

Design and development of a 3D scanning MEMS OCT probe using a novel SiOB package assembly

Nanguang Chen, C. S. Premachandran, Malini Olivo, 2008 .

Design, simulation and process optimization of AuInSn low temperature TLP bonding for 3D IC Stacking

Siong Chiew Ong, V. N. Sekhar, C. Selvanayagam, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Development of a method to identify problems of a bilevel nature within different engineering applications

Ahmad Khairyanto, A. Khairyanto, 2008 .

Influence of optical probe packaging on a 3D MEMS scanning micro-mirror for optical coherence tomography (OCT) applications

M. Olivo, C. Premachandran, J. Singh, 2008, 2008 58th Electronic Components and Technology Conference.

A novel, wafer-level stacking method for low-chip yield and non-uniform, chip-size wafers for MEMS and 3D SIP applications

J. Lau, Won Kyoung Choi, Ling Xie, 2008, 2008 58th Electronic Components and Technology Conference.

Towards automated remanufacturing process with additive manufacturing

Shu Beng Tor, Ahmad Khairyanto, Wee Ching Pang, 2018 .

Bessel Beams in Ophthalmology: A Review

T. Aung, S. Khonina, A. Khairyanto, 2023, Micromachines.