J. Prince

发表

A broadband CPW-to-microstrip via-less transition for on wafer package probing applications

K. Melde, J.L. Prince, L. Zhu, 2003, Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710).

Characterization of electromagnetic systems using Pade/spl acute/ approximation with expansion at infinity

S. Dvorak, J. Prince, T. Zhou, 2003 .

Application of the Pade approximation via Lanczos (PVL) algorithm to electromagnetic systems with expansion at infinity

S. Dvorak, J. Prince, T. Zhou, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

A parameteric study of the attenuation constant of lossy microstrip lines

J. L. Prince, Andreas C. Cangellaris, L. P. Vakanas, 1990 .

Finite-difference time-domain analysis of pulse propagation in multichip module interconnects

A. Cangellaris, J. Prince, M. Gribbons, 1993 .

Triangle Impulse Response (TIR) Calculation for

S. Dvorak, J. Prince, T. Zhou, 2002 .

Crosstalk Analysis for High-Speed Pulse Propagation on Frequency-Dependent Lossy Electrical Interconnections

S. Dvorak, J. Prince, T. Zhou, 2002, Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects.

Triangle impulse response (TIR) calculation for lossy transmission line simulation

S. Dvorak, J. Prince, T. Zhou, 2001 .

Effects of RCA claning upon breakdown voltages of thin gate oxides

C. C. Johnson, J. Prince, K. Kurtz, 1991, [1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium.

On the deeply depleted MOS capacitor

J. L. Prince, J. J. Wortman, J. Wortman, 1970 .

Development of a time-domain simulation methodology for the hybrid phase-pole interconnect macromodel

J. L. Prince, Steven L. Dvorak, Bing Zhong, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Triangle impulse response (TIR) calculation for lossy transmission line simulation

Tingdong Zhou, Zhaoqing Chen, S. Dvorak, 2001, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).

Closed-form representations for triangle impulse responses associated with single and coupled lossy transmission lines

S. Dvorak, J. Prince, T. Zhou, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

The applications of EBG structures in power/ground plane pair SSN suppression

K. Melde, J. Prince, Guang Chen, 2004, Electrical Performance of Electronic Packaging - 2004.

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part II—Unified Constitutive Models, Validation, and Design

C. Desai, T. Kundu, J. Prince, 1997 .

Influence of a Floating Plane on Effective Ground Plane Inductance in Multilayer Packages

A. Cangellaris, J. Prince, M. Lopez, 1998 .

Electronic packaging adhesive fatigue life prediction using thermal cycling step-stress testing

J. Prince, Xijin Tian, X. Tian, 2002, Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318).

Diffusion of Boron from Implanted Sources under Oxidizing Conditions

J. Prince, F. Schwettmann, 1974 .

Rigorous electromagnetic modeling of chip-to-package (first-level) interconnections

J. Prince, Yuh-sheng Tsuei, A. Cangellaris, 1993, Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).

Dielectric constant and loss tangent measurement using a stripline fixture

John L. Prince, Heping Yue, Kathleen L. Virga, 1998, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B.

A new discrete transmission line model for passive model order reduction and macromodeling of high-speed interconnections

J. L. Prince, Andreas C. Cangellaris, S. Pasha, 1999 .

S-parameter analysis of multiconductor, integrated circuit interconnect systems

Andreas C. Cangellaris, John L. Prince, Bradly J. Cooke, 1992, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..

S-parameter VLSI transmission line analysis

Andreas C. Cangellaris, J. L. Prince, Olgierd A. Palusinski, 1989, Proceedings., 39th Electronic Components Conference.

Application specific CMOS output driver circuit design techniques to reduce simultaneous switching noise

J. L. Prince, R. Senthinathan, J. Prince, 1993 .

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration

Tribikram Kundu, J. L. Prince, Chandra S. Desai, 1997 .

Thermomechanical analysis in electronic packaging with unified constitutive model for materials and joints

Cemal Basaran, J. L. Prince, Terrance J. Dishongh, 1998 .

Electronic Packaging: Design, Materials, Process, and Reliability

Wataru Nakayama, John H Lau, J. Lau, 1998 .

X- and gamma-ray hardness of floating-gate EEPROM technology as applied to implantable medical devices

J. L. Prince, L. J. Stotts, L. Stotts, 1999 .

A study of a hybrid phase-pole macromodel for transient simulation of complex interconnects structures

Tao Hu, John L. Prince, Dawei Fu, 2005, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

An efficient full-wave layered interconnect simulator (UA-FWLIS)

Zhaohui Zhu, Xing Wang, S.L. Dvorak, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Exploration of a new, efficient approach to modeling and simulation of interconnects

J. L. Prince, Steven L. Dvorak, Bing Zhong, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Improved global rational approximation macromodeling algorithm for networks characterized by frequency-sampled data

John L. Prince, K. L. Virga, Mark Elzinga, 2000 .

Electrical characterization of integrated circuit molding compound

John L. Prince, K. L. Virga, C. C. Green, 1999 .

Characterization of frequency dependent dielectric packaging media using differential and multiple-reflection techniques on a precision stripline test structure

J. L. Prince, K. L. Virga, C. C. Green, 1998, IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370).

nnect Transmission Line

C. E. Abernethy, A. Cangellaris, J. Prince, 1996 .

Integrated Circuit Characteristics at 260°C for Aircraft Engine-Control Applications

L. Palkuti, J. Prince, A. Glista, 1979 .

Parametric study of a VLSI plastic package using locally refined finite element models

J. R. Umaretiya, Z. J. Staszak, B. Simon, 1989, Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

Frequency-dependent inductance and resistance calculation for three-dimensional structures in high-speed interconnect systems

A.C. Cangellaris, J.L. Prince, J. Prince, 1989, Proceedings., 39th Electronic Components Conference.

Influence of parameter distribution on simultaneous switching noise (SSN) for CMOS output drivers

J. L. Prince, A. Vaidyanath, J. Prince, 1994, Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging.

Modeling and simulation of package and interconnects

J. L. Prince, J. Prince, 1994, Proceedings of IEEE Bipolar/BiCMOS Circuits and Technology Meeting.

Extension of an Efficient Moment-Methods-Based Full-Wave Layered Interconnect Simulator to Finite-Width Expansion Functions

Qiang Li, Zhaohui Zhu, Xing Wang, 2007, IEEE Transactions on Advanced Packaging.

Investigation of the sparse MoM reaction matrices produced in stripline packaging problems

Zhaohui Zhu, Xing Wang, S.L. Dvorak, 2006, 56th Electronic Components and Technology Conference 2006.

A study of the fields associated with horizontal dipole sources in stripline circuits

J. L. Prince, Steven L. Dvorak, S. Dvorak, 2002 .

Reaction analysis in stripline circuits

J. L. Prince, Steven L. Dvorak, S. Kabir, 2001 .

Dispersion of picosecond pulses propagating on microstrip interconnections on semiconductor integrated-circuit substrates

Andreas C. Cangellaris, John L. Prince, Michael F. Pasik, 1991 .

Dramatic Improvements in the Matrix Solution Time for Method of Moment Problems Involving Stripline Interconnects

Zhaohui Zhu, Xing Wang, S.L. Dvorak, 2007, IEEE Transactions on Advanced Packaging.

A boundary element formulation of the conjugate heat transfer from a convectively cooled discrete heat source mounted on a conductive substrate

J. L. Prince, Alfonso Ortega, Cho Lik Chan, 1994 .

Second quadrant effects in silicon solar cells

J. L. Prince, J. W. Lathrop, R. A. Hartman, 1980 .

Extraction of the hybrid phase-pole macromodel parameters using the matrix pencil method

S.L. Dvorak, J.L. Prince, Tao Hu, 2002, Electrical Performance of Electronic Packaging,.

The role of universities in electronic packaging engineering

J.L. Prince, Z. J. Staszak, D.J. Hamilton, 1985, Proceedings of the IEEE.

Frequency-dependent [L] and [R] matrices for lossy microstrip lines

Andreas C. Cangellaris, John L. Prince, L. P. Vakanas, 1991 .

Accurate frequency domain modeling of LTCC solid‐gridded plane structures

John L. Prince, K. L. Virga, Guang Chen, 2003 .