J. Huang
发表
Q. Wang,
Jian Cai,
Tiwei Wei,
2014,
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
J. Lau,
Ming Li,
J. Huang,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
J. Lau,
Ming Li,
J. Huang,
2023,
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).
J. Lau,
J. Huang,
H. Liu,
2023,
IMAPSource Proceedings.
J. Lau,
J. Huang,
H. Liu,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
J. Huang,
Tzvy-Jang Tseng,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
J. Lau,
J. Huang,
H. Liu,
2021,
International Symposium on Microelectronics.